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IJEETC 2025 Vol.14(3): 180-187
doi: 10.18178/ijeetc.14.3.180-187

A Simulation Method for Temperature Monitoring of Medium Voltage Underground Cables Insulation

Quyen M. Hoang1, Hai D. Tran1, and Nga T. T. Vu2,*
1. Faculty of Electrical Engineering, School of Electrical and Electronic Engineering, Hanoi University of Industry, Hanoi, Vietnam
2. Faculty of Electrical Engineering, Electric Power University, Hanoi, Vietnam
Email: quyenhm@haui.edu.vn (Q.M..H.), tranduchaidh07@gmail.com (H.D.T.), ngavtt@epu.edu.vn (N.T.T.V.)
*Corresponding author

Manuscript received February 24, 2025; revised April 10, 2025; accepted May 11, 2025

Abstract—Temperature is one of the primary causes of medium voltage cable failures. When the temperature exceeds the allowable limit, the cable components may degrade, affecting the lifespan and operational efficiency of the power system. In order to maintain the safe operation of power systems and minimize the likelihood of severe accidents, it is crucial to analyze the temperature distribution in medium voltage underground cables. In this study, the time-dependent temperature distribution within the 5.5 mm thick Cross-Linked Polyethylene (XLPE) insulation layer of medium voltage cables is analyzed using the finite element method. Temperature data collected from the cable sheath surface is utilized to simulate the thermal variation in cable insulation layer under the varying of core current and sheath temperature. Additionally, a temperature warning threshold is calculated to issue alerts and prevent overheating. The variations in the electric field under these conditions are also examined. The results provide valuable insights for optimizing the installation and operation of medium voltage power cables.

 
Index Terms—monitoring, Medium Voltage (MV) underground cable, reliability, temperature distribution, Cross-Linked Polyethylene (XLPE)

Cite: Quyen M. Hoang, Hai D. Tran, and Nga T. T. Vu, "A Simulation Method for Temperature Monitoring of Medium Voltage Underground Cables Insulation," International Journal of Electrical and Electronic Engineering & Telecommunications, Vol. 14, No. 3, pp. 180-187, 2025. doi: 10.18178/ijeetc.14.3.180-187

Copyright © 2025 by the authors. This is an open access article distributed under the Creative Commons Attribution License (CC BY 4.0), which permits use, distribution and reproduction in any medium, provided that the article is properly cited, the use is non-commercial and no modifications or adaptations are made.