Abstract—The power dissipated by Deep Sub-Micron Technology bus is directly related to the switching activity of the coupling capacitance that exist between the bus lines and also the switching activity of the self capacitance present between the bus interconnect and the ground. When there is an opposite swing in two wires the coupling capacitance between them is doubled and this phenomenon leading to more capacitance is called miller-effect which produces devasting effects in integrated circuits. In Deep Sub-micron Technology the power dissipation due to coupling transitions, is appreciably more (75%) than that due to self transitions (25%), necessitates the need for reducing the number of coupling transitions also. The main aim of the proposed technique in this paper is to save the energy dissipated due to the transitions on data buses.

Index Terms—Buffer, Modularity, High Technology Product Producing Factory (HTPPF)

Cite: K Padmapriya, "MODIFIED SSC METHOD FOR DSM BUSES," International Journal of Electrical and Electronic Engineering & Telecommunications, Vol. 2, No. 3, pp. 49-55, July 2013.